Tenders Are Invited For Wafer Saw

A Semi-Automatic Wafer Saw Is Being Advertised, Designed For Wafers With A Diameter Of Up To 6 Or Sections With An Area Of ​​Up To 220 X 160 Mm. The Wafer Saw Should Also Be Designed For High-Precision Cuts And Be Used For Dividing And Structuring Wafers. It Should Also Be Possible To Cut A Workpiece Into Pieces Of Up To 5 X 5 Mm And To Have Entire Wafers Processed Automatically. The System Must Be Designed To Process Various Materials, Including Pure Si, Ln, And Quartz Wafers As Well As Thin Film Composites Such As Thin Film Lithium Niobate And Thin Film Silicon As Well As Iii-V Materials. There Must Be The Possibility Of Retrofitting The Model With Functions Such As Ultrasound -Retrofitting Saws. The Advertised Configuration Includes A Water Treatment System, Which Is Required To Operate The Saw.