GTR 88342492

Tenders Are Invited For Xuv Piezo Cluster

ICB — International Competitive Bid Closed Western Europe
Tender Information
GTR Reference
88342492
Tendering Authority
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Tender No
EB-OUT 6528
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Xuv Piezo Cluster
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Western Europe
Political Region
European Union
Last Date of Bid Submission
13-01-2025 Closed
Work Detail
The Xuv Optics Group In Mesa+ Institute At University Of Twente Tends To Invest In The Xuv Piezo Cluster To Carry Research On Piezoelectric Film-Based Sensors And Actuators. The Aim Is To Scale Up The Piezoelectric Film Coating Capabilities To Larger Substrate Dimensions With More Advanced Process Control Systems That Enable To Explore A Broader Process Window. The Xuv Piezo Cluster Will Be Used For The Deposition Of Pure Metals, Metallic Oxides And Piezoelectric Layers Onto Various Substrates To Be Further Processed Using Photolithography And Deposition Steps In The Mesa+ Nanolab Facilities. Brief Description Of The Capabilities Is Outlined Below: The Xuv Piezo Cluster Shall Be Capable Of Processing At Least 200 Mm Diameter Substrates. The Xuv Piezo Cluster Shall Include A Chamber For Deposition Of Piezoelectric Pb(Zr,Ti)O3 (Pzt) Layer That Acts As The Active Layer For Sensor And Actuator Applications. The Xuv Piezo Cluster Shall Include A Chamber Or Chambers For Deposition Of Pure Metals Such As Pt, Gold (Au) Or Conductive Metal Oxides Such As Lanio3 Or Srruo3 Layers. The Xuv Piezo Cluster Shall Have The Capability To Sputter The Typically Used Ti, Ta Or Cr Adhesion Layers Preceding The Pure Metal Layers. The Xuv Piezo Cluster Shall Include A Load-Lock Chamber For Fast Sample Loading And Reaching Of The Base Pressure. The Xuv Piezo Cluster Shall Include A Transfer Chamber Enabling The Transfer Of Substrates Between Deposition Chambers Without Breaking The Vacuum. The Xuv Piezo Cluster Shall Be Further Expandable To Include A Pre-Treatment Chamber For Purposes Such As Degassing Or Etching Before Or After The Layers Are Deposited. The Full Technical Specifications Can Be Found In Appendix B: Schedule Of Demands And Wishes. Tenderers Can Derive No Rights From The Indicative Specification. All Amounts Are Specified Excluding Vat.
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