Tenders Are Invited For Microelectronic Machinery And Apparatus – Supply And Installation Of Automatic Equipment For 200Mm Dion Beam Engraving Plates

Microelectronic Machinery And Apparatus – Supply And Installation Of Automatic Equipment For 200Mm Dion Beam Engraving Plates. Cea Leti Wishes To Acquire Automatic Equipment For 200Mm Dion Beam Etching Plates With A Nitrided Silicon Deposition Solution (Optional) The Dion Beam Etching Chamber Must Be Able To Perform Reactive Dion Beam Etching (Ribe) And Etching By Chemically Assisted Ion Beam (Caibe) With Argon, Oxygen, Fluorine And Chlorine Gases. The Equipment Must Process Different Types Of 200 Mm Wafers (Bonded, Silicon On Glass Or Silicon On Silicon) And Of Varying Thicknesses (From 500 To 1500 Um).