Machine Tools For Working Stone, Ceramics, Concrete Or Glass - Waferbond_Anlage - Pr478860-2660-W. 1 Piece Wafer Bond System With Options: 18.2 Alignment Method: With Registration Marks 19.3 >10 Kn, On The Entire Substrate Surface 20.2.1 One Or Optionally Two Substrates Can Can Be Coated In One Coating Step. 20.5 The Possibility Of Other Materials To Be Deposited As Silicon. Possible Materials Must Be Named. 22.3 A Quartz Glass Wafer, Which Is To Be Connected To A Quartz Glass Wafer 28.1 The Machine Must Be Equipped With Devices Be Equipped To Handle Wafers With A Nominal Diameter Of >100 Mm. The Available Sizes Of The Devices Must Be Specified. 31.2 Stack Height In Bonded State Up To 30 Mm 35. Software Updates For At Least 3 Years A Separate Price. 36. An Annual Maintenance Contract For At Least 2 Years Must Be Offered Separately. The Service Must Include A Complete Inspection Of The Device With Particular Attention To All Safety-Relevant Components And Functions
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
