System For The Removal Of Plasma Materials Of The Rie Reactive Ion Etching Type. Supply, Installation And Commissioning Of A Plasma Etching System For The Removal Of Silicon, Polysilic, Dopped Oxides, Oxinitures And Nitides In Plasma On Production Batches Of 25 Wafers Of 150 Mm Substrates Prepared To Treat 200 Mm Substrates.
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