GTR 72163138

Tenders Are Invited For W-Band Rf Passive Hardware For High Throughput Telecommunication Payloads

ICB — International Competitive Bid Closed Western Europe
Tender Information
GTR Reference
72163138
Tendering Authority
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Tender No
1-11813
Financer Name
Self-Funded
Work Title
Tenders Are Invited For W-Band Rf Passive Hardware For High Throughput Telecommunication Payloads
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Western Europe
Political Region
European Union
Last Date of Bid Submission
22-01-2024 Closed
Work Detail
Tenders Are Invited For W-Band Rf Passive Hardware For High Throughput Telecommunication Payloads The Objective Of The Activity Is To Design, Manufacture And Test Low-Loss W-Band Rf Passive Equipment (Filters, Multiplexers And Transmission Lines) For Future Very High Throughput Telecommunication Payloads. Targeted Improvements: Enabling Technology For W-Band Payloads. Description: W-Band Has The Potential To Provide The Feeder Link Capacity Needed For Future Very High Throughput Satellites (Vhts). The Frequency Allocation For This Band Allows For A Contiguous 5 Ghz Bandwidth To Enhance The System Capacity And Can Reduce The Number Of Required Gateway Earth Stations. Among Others, Key Elements In W-Band Communication Payloads Are Rf Passive Components. At These Mm-Wave Frequencies There Are Technical Challenges To Overcome, Including Ohmic Losses, Sensitivity To Manufacturing Tolerances, Thermal Stability And Power Handling (Up To 100 W). This Activity Will Develop High-Performance Low-Loss W-Band Rf Passive Hardware, Including Rf Filters In The 71 - 76 Ghz Frequency Band For Feeder Downlinks And Multiplexers, And Investigate Low-Losstransmission Line Technologies. Filter Topologies With Low Sensitivity To Manufacturing Tolerances Could Be Exploited For Tuning-Less Filter Realisations. Possible Means To Reduce Waveguide Insertion Losses, Such As Those Based On Alternative Waveguide Profiles And Overmoded Waveguides, Will Be Investigated. Single-Piece-Part Advanced Manufacturing Techniques, Such As 3D Printing, Are Emerging For The Precision Fabrication Of Lightweight And Low-Loss Components, Enabling Complex-Geometry Components Operating Atmm-Wave Frequencies. Breadboards Of The Most Promising Solutions Will Be Developed And Experimentally Tested To Evaluate The Technologies For Future W-Band Payload Applications. Procurement Policy: C(2) = A Relevant Participation Tender Link : Https://Esastar-Publication-Ext.Sso.Esa.Int/Esatenderactions/Filter/Open
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1065d7e0-5654-41e2-a411-6c4341604271.htm
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