Tenders Are Invited For Ov_Lk_08-23-1115 Multi-Wire Saw With Accessories

Ov_Lk_08-23-1115 Multi-Wire Saw With Accessories. The Leibniz Institute For Crystal Growing (Ikz) In The Forschungsverbund Berlin E.V. Intends To Expand Its Equipment To Include A Multi-Wire Saw (Mws). Multi-Wire Sawing Is The Standard Technology For Separating Crystal Rods Into Multiple Wafers In One Cut. It Is Used In Particular For The Production Of Wafers Made Of Hard And Brittle Materials Such As Sapphire (Al2o3), Mgo, Ga2o3 And Sic. Crystal Blocks With Dimensions Of Up To 150 Mm X 100 Mm X 200 Mm (L X W X H) And A Maximum Diameter Of 100 Mm Are Intended To Be Cut Into Wafers. The Subject Of The Tender Is, Among Other Things, The Delivery, Installation And Commissioning Of A Corresponding Multi-Wire Saw With Accessories. An Acceptance Test Of The System Is Carried Out. The Acceptance Conditions Can Be Found In The Special Contract Conditions (Bvb) Under Point 13.