Tenders Are Invited For A 300Mm Wafer Compatible, Multi-Chamber Pvd Platform

A 300Mm Wafer Compatible, Multi-Chamber Pvd Platform.Greater Than, Or Equal To, 9 Process Chambers Must Be Supported On A Single Platform. These Modules, Including Any Robot Transfer Modules, Must Be Capable Of Ultra-High Vacuum (< 5X10-8 Torr) With (<5X10-9) Preferred. Furthermore, The Following Process Chamber Designs That Must Be Supported Are: 1) Multi-Cathode (>/= 4) Pvd Chamber With A Combination Of Rf And/Or Dc And/Or Pulsed Dc Cathodes Capable Of A Minimum Of 2-Target Co-Sputtering With High-Temperature Heating Capability, 2) A Pre-Clean Chamber To Remove Native Oxides And Other Contaminants, 3) In-Situ High Temperature Anneal Chamber (>600C) Capable Of Injecting Reactive Gases E.G. O2 And N2, 4) Single-Cathode Pvd Chamber With Heating Capability Capable Of High Deposition Rates (>>1Nm/S) And, 5) Cooling Chamber (<100K). The Platform Must Be Compatible With Front Opening Universal Pods With A 25-Slot Capacity, Including An Equipment Front End Module And Load-Lock System For Wafer Loading. Finally, The Deposition Must Be Computer Controlled And Automated Following Defined Recipes. As An Optional, The Platform Should Be Compatible With Automatic Recipe Upload From Fab Management Software Via A Standardized Protocol, For Example Secs/Gem