GTR 54139120
Tenders are invited for Next-Generation Microelectronics Manufacturing (NGMM)
ICB — International Competitive Bid
Closed
Southern Asia
Tender Information
GTR Reference
54139120
Tendering Authority
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Tender No
HR001122S0050
Financer Name
Self-Funded
Work Title
Tenders are invited for Next-Generation Microelectronics Manufacturing (NGMM)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Southern Asia
Last Date of Bid Submission
21-09-2022
Closed
Work Detail
Next-Generation Microelectronics Manufacturing (NGMM) he NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
3a67faea-8907-4d1c-b73e-daa01382f7a2.pdf
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- Publication Document (Tender Document / Tender Notice)
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