GTR 119500583
Tenders Are Invited For Tsinghua University Chip-To-Wafer Vacuum Bonding System Procurement Project
ICB — International Competitive Bid
Closes Nov 09, 2026
Eastern Asia
Tender Information
GTR Reference
119500583
Tendering Authority
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Tender No
清采招第20260527号（TC26190B7）
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Tsinghua University Chip-To-Wafer Vacuum Bonding System Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
09-11-2026
Work Detail
Tsinghua University Wafer-To-Wafer Vacuum Bonding System Procurement Project Public Bidding Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
7c30ef5d-50ab-44b6-96bb-99e72ebece37.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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