GTR 119388543
Tenders Are Invited For Sewing (Wafer Cutting Machine) For Next-Generation High-Efficiency Power Semiconductor Verification Infrastructure Task
NCB — National Competitive Bid
Closes Nov 10, 2026
Eastern Asia
Tender Information
GTR Reference
119388543
Tendering Authority
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Tender No
R26BK01772881
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Sewing (Wafer Cutting Machine) For Next-Generation High-Efficiency Power Semiconductor Verification Infrastructure Task
Bid Type
NCB — National Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,APAC (Asia Pacific)
Last Date of Bid Submission
10-11-2026
Work Detail
Sewing (Wafer Cutting Machine) For Next-Generation High-Efficiency Power Semiconductor Verification Infrastructure Task
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
db1eb399-4439-4b4c-a4b1-c591175260a7.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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