GTR 119122571
Tenders Are Invited For Ultrasonic Bonding Control Platform, Wide Band Gap Semiconductor Dynamic Characteristics Detection Platform And Motor Bearing Fault Test Bench (Secondary)
ICB — International Competitive Bid
Closes Oct 29, 2026
— 3 days left
Eastern Asia
Tender Information
GTR Reference
119122571
Tendering Authority
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Tender No
JXRC-260517.1.2.3B1
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Ultrasonic Bonding Control Platform, Wide Band Gap Semiconductor Dynamic Characteristics Detection Platform And Motor Bearing Fault Test Bench (Secondary)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
29-10-2026
3 days left
Work Detail
Tender Announcement For Xian University Of Technologys Ultrasonic Bonding Control Platform, Wide Bandgap Semiconductor Dynamic Characteristics Detection Platform And Motor Bearing Fault Test Bench (Secondary)
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
b0c9d05e-4303-4cbb-861a-43093eaecf79.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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