Tenders Are Invited For Machines And Apparatus For Testing And Measuring – Semi-Automatic Wafer Prober System For Characterization Of 200-Mm Wafers

Machines And Apparatus For Testing And Measuring – Semi-Automatic Wafer Prober System For Characterization Of 200-Mm Wafers. Description Of The Procurement - Type And Scope Of Supplies / Requirements The Procurement Comprises The Supply Of A Complete Semi-Automatic Wafer Prober System For The Electrical And Rf Characterization Of 200-Mm Wafers For Research And Laboratory Applications At Ihp. The Scope Of Supply Includes, In Particular, A Semi-Automatic 200-Mm Wafer Prober With Vacuum Chuck, Precision Xy/Z/Theta Positioning, Shielded Prober Chamber, Six Individual Electrical Probes, Two Multi-Contact Probe Holders Suitable For Rf Measurements Up To At Least 6 Ghz, And A Probe Card Adapter. The System Shall Also Include An Automated Microscope, Color And Side-View Cameras, Control Pc, Hardware Control Panel, Control Software, Required Cables, Interfaces, Power Supplies And Replacement Probes. The System Shall Support Dc, Pulsed I-V And Low-Frequency Impedance Measurements Up To At Least 10 Mhz As Well As Rf Characterization. All Components Shall Be Technically Compatible And Capable Of Being Operated As An Integrated System. The Procurement Further Includes Complete Delivery, Transport, Installation, Configuration, Commissioning, Functional Testing, On-Site Training And Provision Of All Required Technical, Operating And Safety Documentation. The Supplier Shall Also Provide Warranty, Service And Spare-Parts/Consumables Availability For The Specified Warranty Period. The System Must Comply With The Specified Mechanical, Electrical, Safety, Emc, Ce, It And Environmental Requirements And Be Suitable For Integration Into The Existing Ihp Laboratory And It Infrastructure.