GTR 118737623
Tenders Are Invited For 12 Inch Integrated Circuit Manufacturing Project Of Hangzhou Hfc Semiconductor Corp.(2)
ICB — International Competitive Bid
Closes Oct 28, 2026
Eastern Asia
Tender Information
GTR Reference
118737623
Tendering Authority
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Tender No
4197-2240HZHFC001/184
Financer Name
Self-Funded
Work Title
Tenders Are Invited For 12 Inch Integrated Circuit Manufacturing Project Of Hangzhou Hfc Semiconductor Corp.(2)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-10-2026
Work Detail
300mm Scrubber, Dielectric layer - plasma Etcher, PEALD Nitride ANM, Copper Chemical Mechanical Polisher and Cleaner, Diffusion Furnace-ALD Nitride, Diffusion Furnace-High Temperature Anneal
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
ccbed3ef-d944-4b74-9fe4-1d4a3c8da93d.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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