GTR 118737622
Tenders Are Invited For 12 Inch Integrated Circuit Manufacturing Project Of Hangzhou Hfc Semiconductor Corp.(2)
ICB — International Competitive Bid
Closes Oct 28, 2026
Eastern Asia
Tender Information
GTR Reference
118737622
Tendering Authority
Subscribe to view
Tender No
4197-2240HZHFC001/185
Financer Name
Self-Funded
Work Title
Tenders Are Invited For 12 Inch Integrated Circuit Manufacturing Project Of Hangzhou Hfc Semiconductor Corp.(2)
Bid Type
ICB — International Competitive Bid
Country
Subscribe to view
Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-10-2026
Work Detail
300mm Scrubber, Dielectric layer - plasma Etcher, PEALD Nitride ANM, Copper Chemical Mechanical Polisher and Cleaner, Diffusion Furnace-ALD Nitride, Diffusion Furnace-High Temperature Anneal
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
0b4eb8a7-610b-4e8e-9ee9-6b5a302c230b.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
Disclaimer
We take all possible care for accurate & authentic tender information. However, users are requested to refer to the original Tender Notice / Tender Document published by the Tender Issuing Agency before taking any decision regarding this tender.