GTR 118336654
Tenders Are Invited For Department Of Mechanical Engineering Wafer And Square Substrate Thickness And Warpage Measurement Equipment Purchase Project
ICB — International Competitive Bid
Closes Oct 07, 2026
— 1 days left
Eastern Asia
Tender Information
GTR Reference
118336654
Tendering Authority
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Tender No
CYAD1150925
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Department Of Mechanical Engineering Wafer And Square Substrate Thickness And Warpage Measurement Equipment Purchase Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
APAC (Asia Pacific)
Last Date of Bid Submission
07-10-2026
1 days left
Work Detail
Department of Mechanical Engineering Wafer and Square Substrate Thickness and Warpage Measurement Equipment Purchase Project
Key Value
Tender Value
3,950,000 - TWD
Tender Documents
Global Tender Document
a303517f-4f09-4025-be9c-7ef48040bac2.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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