Tenders Are Invited For Laboratory, Optical And Precision Equipment (Excl. Glasses) – Wire Bonding Machine Or Wire Bonding Semi-Automatic, - Version As A Table Device -

Laboratory, Optical And Precision Equipment (Excl. Glasses) – Wire Bonding Machine Or Wire Bonding Semi-Automatic, - Version As A Table Device -. Delivery And Commissioning Of A Flexible Wire Bonding Machine Or Semi-Automatic Machine Designed As A Table-Top Device, Which Ensures Precise, Modern And Long-Term Future-Proof Electronics Production And Thus Sustainably Supports Research, Teaching And Student Projects. The Purchase Of A New Wire Bonding Machine Or Semi-Automatic Machine Serves To Sustainably Strengthen Research, Teaching And Student Development Projects In The Area Of ​​Electronics And Microsystem Production. The System Is Intended To Enable State-Of-The-Art, Precise And Efficient Production Of Wired Connections And Thus Significantly Support Both Scientific Work And Practice-Oriented Training Content. Particular Emphasis Is Placed On A High Level Of Flexibility In Order To Cover A Wide Range Of Current And Future Requirements - From Prototype Production To Small Series To Experimental Research Setups. The Machine Should Be Modularly Expandable And Compatible With Various Bonding Processes, Wire And Semiconductor Materials, Housing And Substrate Types As Well As Different Substrate Geometries. By Integrating The System Into Teaching And Research Operations, Students Gain Practical Access To Modern Assembly And Connection Technologies, While Research Groups Benefit From A Reliable, Reproducible And Powerful Bonding Environment. The Investment Thus Creates A Robust Long-Term Infrastructure For Innovative Projects And The Training Of Future Specialists In The Field Of Electronics Manufacturing.