GTR 117810708
Tenders Are Invited For Harbin Engineering University Semiconductor Device Physical Process Basics And Integrated Circuit Integrated Testing And Application Training Platform Procurement Project
ICB — International Competitive Bid
Closes Sep 28, 2026
Eastern Asia
Tender Information
GTR Reference
117810708
Tendering Authority
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Tender No
ZXDC2026G708
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Harbin Engineering University Semiconductor Device Physical Process Basics And Integrated Circuit Integrated Testing And Application Training Platform Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-09-2026
Work Detail
Harbin Engineering University Semiconductor Device Physical Process Basics And Integrated Circuit Integrated Testing And Application Training Platform Procurement Project Public Tender Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
96aaa443-145a-4ec4-94e1-2c0edc62cedd.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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