GTR 117732172
Tenders Are Invited For Wafer Temporary Bonding Machine At Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
117732172
Tendering Authority
Subscribe to view
Tender No
STC26A411
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Wafer Temporary Bonding Machine At Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
Bid Type
ICB — International Competitive Bid
Country
Subscribe to view
Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-09-2026
Closed
Work Detail
Public Tender Announcement For Temporary Wafer Bonding Machine Of Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
e26ebf10-513e-4eb8-9156-6954b3a5097d.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
Disclaimer
We take all possible care for accurate & authentic tender information. However, users are requested to refer to the original Tender Notice / Tender Document published by the Tender Issuing Agency before taking any decision regarding this tender.