GTR 117732171
Tenders Are Invited For Wafer Laser Debonding Machine At Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
117732171
Tendering Authority
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Tender No
STC26A408
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Wafer Laser Debonding Machine At Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-09-2026
Closed
Work Detail
Public Tender Announcement For Wafer Laser Debonding Machine Of Shanghai Institute Of Microsystems And Information Technology, Chinese Academy Of Sciences
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
5a872404-1cd9-4019-bd35-6c7dd543a06f.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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