GTR 117661175
Tenders Are Invited For Non-Contact Wafer Geometry Measuring Instrument
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
117661175
Tendering Authority
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Tender No
A1150917-1
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Non-Contact Wafer Geometry Measuring Instrument
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
APAC (Asia Pacific)
Last Date of Bid Submission
16-09-2026
Closed
Work Detail
Non-contact wafer geometry measuring instrument
Key Value
Tender Value
2,500,000 - TWD
Tender Documents
Global Tender Document
7ef1710f-e7b9-4e01-b0cd-e7a65b203e2b.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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