GTR 117447851
Tenders Are Invited For Laboratory, Optical And Precision Equipments (Excl. Glasses) – Flip Chip Die Bonder
ICB — International Competitive Bid
Closes Sep 22, 2026
Western Europe
Tender Information
GTR Reference
117447851
Tendering Authority
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Tender No
582477-2026
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Laboratory, Optical And Precision Equipments (Excl. Glasses) – Flip Chip Die Bonder
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Western Europe
Political Region
European Union,G20
Last Date of Bid Submission
22-09-2026
Work Detail
Laboratory, Optical And Precision Equipments (Excl. Glasses) – Flip Chip Die Bonder. The Flip-Chip Die Bonder Should Include The Following Process Modules: - Precision Die Bonding (Face Up) - Flip Chip Bonding (Face Down) - Adapted System Work Table - Chip And Substrate Heating With Process Gas Enclosure - Software-Controlled Bonding Force Module - Ultrasonic Bonding Module - In-Situ-Monitoring With Video Camera - Form Generator For Creating Reference Elements For Face Up Alignment - Tool Tip Changing Module - Three Different Tool Tips - Tool Tip Support Including Heater - Dispenser Module For Paste And Liquids - Uv-Curing Module - Die-Eject Module
Key Value
Tender Value
Ref. Document
Tender Documents
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- Publication Document (Tender Document / Tender Notice)
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