Tenders Are Invited For Electromechanical Equipment – ​​Reactive Ion Etching

Electromechanical Equipment – ​​Reactive Ion Etching. The Production Of Free-Standing Waveguides Using Faraday Cage Etching Is Central To The Projects Currently Being Carried Out At The Chair. This Complex Process Requires Two Completely Different Etching Regimes In The Same Chamber. Accordingly, Decoupled Plasma Density And Ion Energy (For P-I-N Diode Integration) Are Required. Further Research Projects Require Active Helium Backside Cooling (For Nanophotonic Waveguides) To Prevent The Electron Beam Resist (E-Beam Paint) From Flowing Or Burning. Maintaining Crystal Quality Is A Top Priority For Additional Projects As Well As For Post-Processing Of Fib-Implanted Defects. High-Energy Ion Bombardment Would Damage The Lattice And Destroy The Optical Coherence Of The Color Centers. It Is Important To Gently Remove Surface Layers (Soft Etch) Without Introducing New Defects Deep Into The Crystal. Ultimately, A Pure Oxygen Plasma Is Required To Structure The Solid Immersion Lenses (Sils) In Diamond, While Sic Requires Fluorine Chemistry (Sf₆/Chf₃). A Gas Box With At Least 5 Lines For Fluorine And Oxygen Processes Is Therefore Necessary In Order To Be Able To Process Both Material Classes Without Hardware Modifications. An Open Load Design Is Also The Most Technically Sensible Solution For The Planned Way Of Working (Processing Small Fragment Samples On Carrier Wafers) Because, In Contrast To Load-Lock Systems, It Does Not Require Any Complex Adaptation Of Robot Handling Systems To Irregular Sample Geometries.