GTR 117266607
Tenders Are Invited For Shanghai Echip Semiconductor Co., Ltd. Die Sorter(1)
ICB — International Competitive Bid
Closes Sep 11, 2026
Eastern Asia
Tender Information
GTR Reference
117266607
Tendering Authority
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Tender No
0613-264025124751
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Shanghai Echip Semiconductor Co., Ltd. Die Sorter(1)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
11-09-2026
Work Detail
Die Sorter(wafer to wafer)
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
65fc0f88-3333-4b5a-a4b9-ab6625c9be68.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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