GTR 116719895
Tenders Are Invited For North China University Normal Temperature Wafer Bonding Machine And Other Equipment Purchase Project
ICB — International Competitive Bid
Closes Aug 28, 2026
— 3 days left
Eastern Asia
Tender Information
GTR Reference
116719895
Tendering Authority
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Tender No
1499002026AGK02205
Financer Name
Self-Funded
Work Title
Tenders Are Invited For North China University Normal Temperature Wafer Bonding Machine And Other Equipment Purchase Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-08-2026
3 days left
Work Detail
Procurement Announcement For Equipment Purchase Projects Such As Normal Temperature Wafer Bonding Machines At North China University
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
7096ed50-4833-4b42-ba9b-3e4290f05622.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
Disclaimer
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