Tenders Are Invited For Electronic Integrated Circuits And Microassemblies – Supply Of An Integrated Advanced Instrumentation Platform For Characterization Of Photonic Devices For The Upv Pilot Line (Upv25, Upv26, Upv29, Upv30, Upv31 And Upv32)

Electronic Integrated Circuits And Microassemblies – Supply Of An Integrated Advanced Instrumentation Platform For Characterization Of Photonic Devices For The Upv Pilot Line (Upv25, Upv26, Upv29, Upv30, Upv31 And Upv32). The Universitat Politècnica De València Participates In The European Initiative Pixeurope Through The Hybrid Photonics Pilot Line, Aimed At The Development, Integration, Validation And Pre-Industrial Demonstration Of Integrated Photonic Circuits. To Achieve This, It Is Necessary To Have An Advanced Instrumentation Platform That Allows For The Coordinated Characterization Of Hybrid Photonic Devices In The Electrical, Optical And Electro-Optical Domains. To This End, It Is Necessary To Proceed With The Acquisition Of The Following Equipment, With Full Compatibility And Interoperability Between Them: Upv25 Microwave Network Analyzer (67 Ghz) Upv26 Lightwave Component Analyzer (67 Ghz) Upv29 Signal And Spectrum Analyzer (67Ghz) Upv30 Vector Signal Generator (67Ghz) Upv31 Optical Modulation Analyzer 70Ghz X 4 Ch Upv32 Arbitrary Waveform Generator 65Ghz X 2 Ch.