GTR 116040447
Tenders Are Invited For New Semiconductor Wafer, Device Manufacturing, Circuit Board Design And Performance Testing Service Procurement Project Of Lanzhou University School Of Information Science And Engineering
ICB — International Competitive Bid
Closes Aug 14, 2026
Eastern Asia
Tender Information
GTR Reference
116040447
Tendering Authority
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Tender No
LZU-2026-145-FW-GK
Financer Name
Self-Funded
Work Title
Tenders Are Invited For New Semiconductor Wafer, Device Manufacturing, Circuit Board Design And Performance Testing Service Procurement Project Of Lanzhou University School Of Information Science And Engineering
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
14-08-2026
Work Detail
Lanzhou University School Of Information Science And Engineering’S New Semiconductor Wafer, Device Manufacturing, Circuit Board Design And Performance Testing Service Procurement Project Public Bidding Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
9d6bdd58-bcb6-4a2b-a8bf-b622b14fd32e.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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