GTR 116012281
Tenders Are Invited For Tsinghua University High-Precision Flip-Chip Bonding System Procurement Project
ICB — International Competitive Bid
Closes Aug 12, 2026
Eastern Asia
Tender Information
GTR Reference
116012281
Tendering Authority
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Tender No
清采招第2026276号（TC2619074）
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Tsinghua University High-Precision Flip-Chip Bonding System Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
12-08-2026
Work Detail
Tsinghua University High-Precision Flip-Chip Bonding System Procurement Project Public Bidding Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
03d646a4-2d83-4592-b01a-58f5bb99f627.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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