Tenders Are Invited For Electronic Integrated Circuits And Microassemblies – Supply, Installation And Commissioning Of An Electron Beam Lithography Tool Up To 8-Inch Wafers (Upv04) And A Sem Equipment (Upv13) For The Pilot Line Of The Upv

Electronic Integrated Circuits And Microassemblies – Supply, Installation And Commissioning Of An Electron Beam Lithography Tool Up To 8-Inch Wafers (Upv04) And A Sem Equipment (Upv13) For The Pilot Line Of The Upv. The Contract Covered By This File Is Necessary In Order To Carry Out Research And Development Work For The Upv Pilot Line, With The Aim Of Improving Existing Advanced Pilot Lines And Developing New Ones Throughout The Union, To Allow The Development And Deployment Of Cutting-Edge Semiconductor Technologies And Next-Generation Semiconductor Technologies. To This End, It Is Necessary To Proceed With The Acquisition, Among Others, Of The Following Equipment: 4 • Upv04 - Electron Beam Lithography Tool Up To 8-Inch Wafers: Electron Beam Lithography Equipment That Exposes Patterns In Sensitive Resistors Using A Focused And Scanned Electron Beam. Write Features With Nanometer Resolution According To Design In Digital File. Dedicated To Nanofabrication Patterning, Especially For Masks And Structures In Photonics, Semiconductors And Nanotechnology. • Upv13 – Sem: Surface Inspection Equipment Using A Focused Electron Beam That Delivers Nanometric Resolution Images. It Allows Obtaining Morphological And Surface Contrast Information, As Well As Contrast Associated With Differences In Composition Or Atomic Number, Depending On The Available Detectors And Imaging Modes. Dedicated To Metrology, Process Inspection And Validation And Quality Control. The Suitability Of The Equipment Is Based On Its Ability To Jointly Cover The Patterning And Dedicated Metrology Requirements Necessary For The Pilot Line Manufacturing Of Hybrid Integrated Photonic Circuits. This Capability Allows Us To Coordinate The Definition Of Exposure Parameters And Points Of Interest For Subsequent Metrology, Integrate External Post-Process Sem Inspection, And Ensure The Traceability And Consistency Of The Data Generated During The Manufacturing Flow.