GTR 115891654
Tenders Are Invited For Interposer Interconnect Chip Process Adjustment And Tape-Out Service Procurement Project
ICB — International Competitive Bid
Closes Aug 13, 2026
Eastern Asia
Tender Information
GTR Reference
115891654
Tendering Authority
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Tender No
THTC-HR-SOC2026006
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Interposer Interconnect Chip Process Adjustment And Tape-Out Service Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
13-08-2026
Work Detail
Public Tender Announcement For Interposer Interconnect Chip Process Adjustment And Tape-Out Service Procurement Project
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
ba93fb52-2e65-4f73-a9a1-f4fef9395bb5.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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