GTR 115844755
Tenders Are Invited For Tsinghua University Chemical Mechanical Polishing (Cmp) Post-Single Wafer Cleaning Equipment Procurement Project
ICB — International Competitive Bid
Closes Aug 07, 2026
Eastern Asia
Tender Information
GTR Reference
115844755
Tendering Authority
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Tender No
清采招第20260259号/XHTC-HW-2026-0984
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Tsinghua University Chemical Mechanical Polishing (Cmp) Post-Single Wafer Cleaning Equipment Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
07-08-2026
Work Detail
Tsinghua University Chemical Mechanical Polishing (Cmp) Post-Single Wafer Cleaning Equipment Procurement Project Public Tender Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
89bce709-7036-4223-a981-f373de621b73.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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