Tenders Are Invited For Industrial Machinery – Laser Micro-Processing System And Laser System

Industrial Machinery – Laser Micro-Processing System And Laser System. The Subject Of The Procurement Project Is The Delivery, Installation, Commissioning And Operational Handover Of A High-Precision Laser Processing System For Micromaterial Processing Including An Integrated Ultra-Short Pulse Laser (Ukp) Beam Source, Training Of The Operating Personnel And Complete System Documentation. The System Enables High-Precision Machining Of Metallic, Ceramic, Polymer, Glass-Based, Crystalline And Semiconducting Materials As Well As Fiber Composite Materials In The Micro And Submicrometer Range, While Maintaining Constant Machining Quality And Repeat Accuracy. It Is Used For Research And Development Projects, Industrial Collaborations And Technology-Oriented Process Developments. The System Offered Must Be Provided As A Fully Integrated, Operationally Complete System. All Components, Ancillary Services And Safety-Relevant Facilities Required For Intended Operation Are Part Of The Offer, Even If They Are Not Expressly Listed Individually. The Laser System Is Intended For Research, Development And Application-Related Process Developments In The Area Of ​​Ultra-Short Pulse Laser Processing. It Is Intended To Be Used In Particular For The Following Applications: - Microstructuring And Micromaterial Processing Of Metallic Materials And Alloys. - Structuring And Processing Functional Materials, Especially Semiconductors. - Processing Of Brittle-Hard Materials Such As Glasses, Crystals And Ceramics. - Structuring Of Polymeric Materials And Composite Materials, Including Fiber-Reinforced Plastics. - Micro-Drilling, Micro-Cutting And Selective Material Removal, For Example For Producing Holes, Channels, Cavities Or For Processing Thin Films. - Precise Surface Modification And Functionalization For Targeted Adaptation Of Surface Properties. - Synchronous, Simultaneous 5-Axis Machining Of Complex Geometries, Especially Rotationally Symmetrical Components, Without Step-By-Step Machining To Increase Precision, Process Quality And Efficiency. - High-Precision Sample Preparation For Downstream High-Resolution Analytical Investigations, For Example To Prepare Cross Sections, Microstructures Or Exposed Material Boundaries For Microscopic Or Spectroscopic Analyses. - Research And Development Work On Process Development In Ultra-Short Pulse Laser Processing. Sample Geometry: - Support The Processing Of Planar Samples, Structured Surfaces And Three-Dimensional Components. - Recording From Very Small Samples (Sub-Millimeter Range) To Larger Substrates Or Components. - The Work Area Must Allow The Processing Of Samples With Lateral Dimensions Of At Least Approximately 300 Mm × 300 Mm. - Possibility Of Processing Larger Components Using Axis Travel. - The System Must Be Able To Accommodate A Maximum Sample Height Of At Least 50-100 Mm