GTR 115822255
Tenders Are Invited For Multi-Project Wafer Mpw Tape-Out Trial Production Of Special Chips For Security Management And Control Of Cyber-Physical Fusion Systems
ICB — International Competitive Bid
Closes Aug 10, 2026
Eastern Asia
Tender Information
GTR Reference
115822255
Tendering Authority
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Tender No
西交采招（2026）198
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Multi-Project Wafer Mpw Tape-Out Trial Production Of Special Chips For Security Management And Control Of Cyber-Physical Fusion Systems
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
10-08-2026
Work Detail
Xian Jiaotong Universitys Cyber-Physical Fusion System Security Management And Control Special Chip Multi-Project Wafer Mpw Tape-Out Trial Production Public Bidding Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
826a05d1-362d-4372-8cb9-daccf8f9d1cb.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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