GTR 115307147
Tenders Are Invited For Wafer Bonder(2)
ICB — International Competitive Bid
Closes Jul 28, 2026
Eastern Asia
Tender Information
GTR Reference
115307147
Tendering Authority
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Tender No
0664-2640SUMECF63/03
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Wafer Bonder(2)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
28-07-2026
Work Detail
Wafer bonder
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
41a68dec-5cbf-4ae4-9ec9-65f6ac13c8a3.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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