GTR 115186777
Tenders Are Invited For High And Low Circuit Board Assembly And Other 2 Items
ICB — International Competitive Bid
Closes Jul 14, 2026
— 2 days left
Eastern Asia
Tender Information
GTR Reference
115186777
Tendering Authority
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Tender No
GM15196P152
Financer Name
Self-Funded
Work Title
Tenders Are Invited For High And Low Circuit Board Assembly And Other 2 Items
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
APAC (Asia Pacific)
Last Date of Bid Submission
14-07-2026
2 days left
Work Detail
High and low circuit board assembly and other 2 items
Key Value
Tender Value
5,223,400 - TWD
Tender Documents
Global Tender Document
0b170003-10de-4329-be6b-23db1d1a5405.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
Disclaimer
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