GTR 115174673
Tenders Are Invited For Solder Ball Placement Machine(1)
ICB — International Competitive Bid
Closes Jul 23, 2026
Eastern Asia
Tender Information
GTR Reference
115174673
Tendering Authority
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Tender No
0618-264TC26070FT
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Solder Ball Placement Machine(1)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
23-07-2026
Work Detail
Solder Ball Mounter
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
d002fe71-935b-4645-bc0b-237509ebeccb.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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