GTR 115128760
Tenders Are Invited For Grinding Material Supply System Of 12-Inch Semiconductor Ic Wafer For Ydmt(2)
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
115128760
Tendering Authority
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Tender No
0610-2642IH011182
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Grinding Material Supply System Of 12-Inch Semiconductor Ic Wafer For Ydmt(2)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
22-07-2026
Closed
Work Detail
Procurement of Grinding Material Supply System of 12-inch Semiconductor IC Wafer for YDMT
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
84ebd742-119c-48c4-8e52-56f1c181e26b.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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