GTR 114969604
Tenders Are Invited For 2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instrument And Equipment Upgrading Project-Semiconductor Material Growth Project
ICB — International Competitive Bid
Closes Jul 17, 2026
— 7 days left
Eastern Asia
Tender Information
GTR Reference
114969604
Tendering Authority
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Tender No
ZF2026-35-0441
Financer Name
Self-Funded
Work Title
Tenders Are Invited For 2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instrument And Equipment Upgrading Project-Semiconductor Material Growth Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
17-07-2026
7 days left
Work Detail
2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instrument And Equipment Upgrading Project - Semiconductor Material Growth Project Tender Announcement
Key Value
Tender Value
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Tender Documents
Global Tender Document
a99ec714-1086-4b74-b7f9-4f1913997d04.html
Attachments
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