GTR 114895096
Tenders Are Invited For 2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instrument And Equipment Upgrading Project-Semiconductor Material Micro-Nano Processing Project
ICB — International Competitive Bid
Closes Jul 15, 2026
— 6 days left
Eastern Asia
Tender Information
GTR Reference
114895096
Tendering Authority
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Tender No
26AT186046904365
Financer Name
Self-Funded
Work Title
Tenders Are Invited For 2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instrument And Equipment Upgrading Project-Semiconductor Material Micro-Nano Processing Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
15-07-2026
6 days left
Work Detail
2026 Tongling University Copper-Based New Materials And Advanced Manufacturing Discipline Group Scientific Research Instruments And Equipment Renovation Project - Semiconductor Material Micro-Nano Processing Project Tender Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
a6659cba-3382-42b3-8bd6-c7a250f7fa88.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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