Tenders Are Invited For The Supply, Delivery And Validation Of A Digital Microscope System For Tyndall National Institute, University College Cork

Tenders Are Required To Provide A Digital Microscope System For Advanced Inspection, Characterization, Imaging, And Dimensional Analysis Of Electronic And Microelectronic Structures. The System Will Be Used For High-Resolution Observation And Measurement Of Multilayer Pcb Structures, Integrated Circuit Dies, Semiconductor Devices, 3D-Printed Electronic Components, Interconnects, Solder Joints, Micro-Vias, And Related Laboratory Samples. The Proposed System Must Provide Integrated Hardware And Software Capabilities For High-Resolution Imaging, 2D And 3D Measurement, Surface Profiling, Focus Stacking, Image Stitching, Tilted Observation, And Automated Repetition Of Setup Conditions Such As Image Capturing And 2D/3D Surface Characterization. The System Must Operate As A Fully Integrated Bench-Top Solution, Including Embedded Computing And All Software Licenses Required For Measurement, Characterization, Image Acquisition, Analysis, And Data Export.