GTR 114095156
Tenders Are Invited For Surface Activation Wafer Bonding Equipment Procurement Project Of Institute Of Microelectronics, Chinese Academy Of Sciences
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
114095156
Tendering Authority
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Tender No
OITC-G260390878
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Surface Activation Wafer Bonding Equipment Procurement Project Of Institute Of Microelectronics, Chinese Academy Of Sciences
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
26-06-2026
Closed
Work Detail
Public Bidding Announcement For The Surface Activated Wafer Bonding Equipment Procurement Project (Second) Of The Institute Of Microelectronics, Chinese Academy Of Sciences
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
901bfa8a-b3c2-4a66-bd1f-1e637a08c140.html
Attachments
Additional Details Available on Click
- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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