GTR 114021246
Tenders Are Invited For Laboratory, Optical And Precision Equipment (Excl. Glasses) – Purchase Of A Drie/Rie System (Plasma Etching System)
ICB — International Competitive Bid
Western Europe
Tender Information
GTR Reference
114021246
Tendering Authority
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Tender No
388383-2026
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Laboratory, Optical And Precision Equipment (Excl. Glasses) – Purchase Of A Drie/Rie System (Plasma Etching System)
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Western Europe
Political Region
European Union,G20
Last Date of Bid Submission
10-07-2026
Work Detail
Laboratory, Optical And Precision Equipment (Excl. Glasses) – Purchase Of A Drie/Rie System (Plasma Etching System). - The Function Must Be Verified During Commissioning On Silicon Wafers With A Thickness Of At Least 380Μm With An Etching Stop On 1500-2500Nm Thermal Silicon Dioxide. The Proof Is Carried Out By An Overetch Of >10Μm After Reaching The End Point. - 1500-2500Nm Thermal Silicon Dioxide With Opened Structures Of 250X250µm (+/-10Μm) In An X / Y Pitch Of 3000Μm, Evenly Distributed Across The Wafer, Also Serves As The Etching Mask In This Acceptance Test. - The Wafers Are Made Available By The Client As Part Of The Sat (System Acceptance At The Destination). - The Parameters Must Be Verified Within The 90Mm Diameter Core Area For A 100Mm Wafer And Within The 140Mm Core Area For A 150Mm Wafer (5Mm Edge Exclusion Each). - The Average Etching Rate From The Start Of The Etching Must Be At Least 10Μm/Min In The Test. - The One-Sided Deviation From The Tangent Of The Etching Edge Must Not Be More Than 10Μm For Any Structure. 05 1 Endpoint Detection Process Monitoring And Endpoint Control Must Be Carried Out Via Optical Analysis Of The Plasma Emission Using The Characteristic Emission Lines. At Least The Range From 250 - 850Nm Must Be Accessible For Evaluation. - The End Point Detection Must Be Implemented In Terms Of Resolution And Sensitivity So That The End Point Is Reliably Detected Even With Small Open Areas <5%. - At Least The Following Endpoint Detections Should Be Possible With A Maximum Of 5% Open Area: O Silicon Etching With Endpoint On Sio2 O Silicon Etching With Endpoint On Al O Silicon Etching With Endpoint On Photoresist O Sixny Etching With Endpoint On Sio2 O Sixny Etching With Endpoint On Si O Sio2 Etching With Endpoint On Si 06 1 Software And System Control - The Operating Software Must At Least Have The Following User Levels Included: O Operator Who Is Only Allowed To Start Existing Recipes. O Engineer Who Is Also Permitted To Create And Change Recipes (Optionally With Password Protection By The Customer). O Service That Also Allows Manual Control Of The System And Bypassing Interlocks (Optionally With Password Protection By The Customer). - If Microsoft Windows Is Used As The Operating System, It Must Be Based On Version 11 Or 10 Ltsc. - The Operating Software Must Contain An Automated Leak Test And Mfc Function Test. - The Control Concept Must Be Based On A Direct One-To-One Connection To The Sensors And Actuators (One Control Channel To A Sensor Or Actuator) - There Must Be Channel-By-Channel Diagnostics For The Control Channels (On/Off) And The Corresponding Status Information (Ok, Short Circuit, Interruption) - Data Logging Must Be Carried Out At Intervals? 250 Ms May Be Possible. - In Order To Precisely Control The Chronological Sequence In The Processes, Process Steps Must Have A Total Length Of Up To ? 10 Ms Can Be Defined. - The Number Of Process Recipes That Can Be Created Should Not Be Determined
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