GTR 114007447
Tenders Are Invited For Wafer-Level Chip Low-Temperature Testing System Procurement Project Of Xinjiang Institute Of Physics And Chemistry Technology, Chinese Academy Of Sciences
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
114007447
Tendering Authority
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Tender No
OITC-G260582217
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Wafer-Level Chip Low-Temperature Testing System Procurement Project Of Xinjiang Institute Of Physics And Chemistry Technology, Chinese Academy Of Sciences
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
25-06-2026
Closed
Work Detail
Public Tender Announcement For The Procurement Project Of Wafer Level Chip Low Temperature Testing System Of Xinjiang Institute Of Physics And Chemistry Technology, Chinese Academy Of Sciences
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
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Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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