Tenders Are Invited For D-Band Transceiver Module For 6G Satellite Systems

Tenders are invited for D-Band Transceiver Module for 6g Satellite Systems (Artes 4.0 Spl 5g/6g 5c.542) - Expro+ Objective: The objective of the activity is to design, build, test an integrated D-band transceiver module for high data rate satcom applications.TargetedImprovements: - Enabling D-band satellite links with higher than 10Gbit/sec- Increasing the transmission capacities by a factor of 4.- Smaller footprint and weight than Ka, V-band ISL or even optical ISL.- Less risk for interference as spectrum not completely allocated.- More resilient compared to Optical ISL (e.g. pointing misalignment or thermal effects).Description: The current state of satellite communication technologies, particularly in Low Earth Orbit (LEO) constellations, relies on existing RF and microwave frequencies, which oftenstruggle to meet the growing demand for higher bandwidth and faster data rates. Withthe advent of 5G and the transition towards 6G, current systems face significantchallenges in scaling data throughput and maintaining efficient communication, especially beyond the atmosphere. This challenge is exacerbated by the limitations of traditionalfrequency bands and the complexity of integrating both passive and active elements within semiconductor-based antenna arrays.The introduction of sub-Terahertz frequencies, specifically in the D-Band range of 110 to 170 GHz, can offer a solution to these issues. These higher frequency bands providesignificantly larger bandwidths, allowing for faster data rates, lower power consumption, and smaller,more efficient hardware. However, fully utilizing the D-band spectrumrequires innovative concept to integrate both active components, such as amplifiers and receivers, and passive components, such as filters, with advanced semiconductor-basedantenna arrays.This project will address these challenges by developing two D-Band transceiver module engineering models, using the latest advancements in MMIC (Monolithic MicrowaveIntegrated Circuit) chipset technologies and packaging techniques, enabling future 6G NTN (Non-Terrestrial Network) phased-array applications. It will focus on the integrationof both active (e.g. amplifiers, receivers) and passiveelements (e.g. filters) with semiconductor-based antenna arrays. This integration is crucial for power efficiency, reducingpower losses, and ensuring scalable solutions that can be applied across satellite constellations. In addition to addressing integration challenges, the proposed activity willexplore advanced multiplexing techniques, such as Orbital Angular Momentum (OAM), which can significantly increase communication capacity without requiring additionalfrequency bandwidth. This novel approach promises to optimize system performance and unlock greater scalability for satellite communication systems in the 6G era. Theproject will first focus onbreadboarding critical components like the high-power amplifier, receiver, filtering functions and antenna. Subsequently, two engineering modeltransceiver modules with critical functions will be manufactured and tested. A point-to-point link demonstrator will becreated for testing, ensuring that the system meets at leastone specific 6G use case such as Joint Communication and Sensing (JCAS), Multi-orbit Inter-satellite Link (ISL), or Extreme Capacity Backhaul (xHaul).Read more Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open

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