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    • Tenders Are Invited For Sic Substrate Wafer Dislocation Defect Optical Non-Destructive Testing Equipment(2)

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    112933232
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    0664-2640SUMECA96/01
    Self-Funded
    Tenders Are Invited For Sic Substrate Wafer Dislocation Defect Optical Non-Destructive Testing Equipment(2)
    NCB
    You can view only after subscription.
    Eastern Asia
    Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
    02-06-2026

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    SiC substrate wafer dislocation defect optical non-destructive testing equipment

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