GTR 112580473
Tenders Are Invited For Layout Design Of The Application Test Chip For Low-Cost Die-To-Die Interface, 1 Set
ICB — International Competitive Bid
Closed
Asia
Tender Information
GTR Reference
112580473
Tendering Authority
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Tender No
389228
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Layout Design Of The Application Test Chip For Low-Cost Die-To-Die Interface, 1 Set
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
27-05-2026
Closed
Work Detail
Layout Design Of The Application Test Chip For Low-Cost Die-To-Die Interface, 1 Set
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
ab56d26a-56f7-4871-a369-50e9aac6dd24.html
Attachments
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- Publication Document (Tender Document / Tender Notice)
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