GTR 112532470
Tenders Are Invited For Beijing University Of Posts And Telecommunications Multi-Project Wafer Tape-Out Procurement Project
ICB — International Competitive Bid
Closed
Eastern Asia
Tender Information
GTR Reference
112532470
Tendering Authority
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Tender No
BUPT-FWXCZB-26002（0873-2026HW3L0138）
Financer Name
Self-Funded
Work Title
Tenders Are Invited For Beijing University Of Posts And Telecommunications Multi-Project Wafer Tape-Out Procurement Project
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Eastern Asia
Political Region
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
Last Date of Bid Submission
22-05-2026
Closed
Work Detail
Beijing University Of Posts And Telecommunications’ Multi-Project Wafer Tape-Out Procurement Project Public Bidding Announcement
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
bc78f07c-7d08-4b91-a7d1-31c241432718.html
Attachments
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- Tendering Authority
- Publication Document (Tender Document / Tender Notice)
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