GTR 112471472
Tenders are invited for Copper Pillar Flip Chip Assembly Technology For High Density Components Expro+
ICB — International Competitive Bid
Closed
Western Europe
Tender Information
GTR Reference
112471472
Tendering Authority
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Financer Name
Self-Funded
Work Title
Tenders are invited for Copper Pillar Flip Chip Assembly Technology For High Density Components Expro+
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Western Europe
Political Region
European Union
Last Date of Bid Submission
29-05-2026
Closed
Work Detail
Tenders are invited for Copper Pillar Flip Chip Assembly Technology For High Density Components Expro+
Key Value
Tender Value
Ref. Document
Tender Documents
Global Tender Document
26e648aa-4bf8-428a-8a12-1ae29cce8b2f.htm
Attachments
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- Publication Document (Tender Document / Tender Notice)
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