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    • Tenders Are Invited For Sic Substrate Wafer Dislocation Defect Optical Non-Destructive Testing Equipment(1)

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    112422444
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    0664-2640SUMECA96/01
    Self-Funded
    Tenders Are Invited For Sic Substrate Wafer Dislocation Defect Optical Non-Destructive Testing Equipment(1)
    NCB
    You can view only after subscription.
    Eastern Asia
    Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
    22-05-2026

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    SiC substrate wafer dislocation defect optical non-destructive testing equipment

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    Global Tender Document 414791af-b64e-4702-ae96-89eb233967cc.html
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