Laboratory, Optical And Precision Equipments (Excl. Glasses) – Wafer Metrology. The Object Of The Tender Is Semi-Automatic Wafer Metrology Tool (Later Also “Tool”) For Measurement Of Total Thickness, Ttv (Total Thickness Variation), Warp, Bow, Metallization Bumps, Trench Or Via Depth And Geometric Factors In Substrates Typical In Semiconductor Industry Such As But Not Limited To Silicon Wafers, Chips, Stacked Wafers, Stacked Chips, Samples Containing Mixed Oxides, Or/And Thin Materials Deposited. The Tool Must Be Compatible With Installation In An Iso 4 Classified Cleanroom. The Object Of The Tender Process Is Described In More Detail In The Invitation To Tender Documents.
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
